Aiming to realize high performance integrated circuits and intelligent sensors with intelligent functions

Equipment

The research environment in Toyohashi University of Technology is very blessed. Because We have only one Electron Device Reserch Center in Japan that enable Designing, fabricating and evaluating  2-inch and 4-inch level device.

CL1

Electron Device Research Center

 

Ultra-pure water plants Clean bench for chemical treatment
N2 blower Wafer spinning drier
Oxidation/Annealing furnace for 4 inch wafer Phosphorus diffusion furnace for 4 inch wafer
Ion implantation equipment Al Sputter
Metal (3 targets) Sputter PL-CVD for Poly-Silicon
PL-CVD for TEOS-SiO2 & Si3N4 PEDVD for BPSG
Reactive Ion Etching(RIE) of silicon RIE for metal
O2 ashing equipment Anisotropic wet etching system(TMAH)
EB lithography exposure g line stepper
i line stepper Resist coater/developer
Spinner Spray coater
Projection aligner Mask aligner
Contact aligner for 2 inch wafer Contact aligner for 4 inch wafer
Gold wire bonding Die bonder
Dicing equiment Anodic bonding apparatus
Vacuum anodic bonding apparatus Wafer probing system
Variable temperature probing system Hg probing system
Semiconductor parameter analyzer LCR impedance analyzer
Wafer flatness tester Ellipsometer
Spectroscopic ellipsometer Surface profiler
Laser microscope FE-SEM
Optical microscope 4 point probe
Cadence for mask design SPICE for device simulation
SUPREM for process simulation ANSYS for analysis system
SPECTRA for device simulation TOCCATA for lighting simulation software

Electron Device Research Center

Venture Business Laboratory

ICP etching equipment Reactive ion etching equipment
XeF2-Si etching equipment Sputter equipment (3 targets)
Plasma CVD equipment H2 gas annealing furnace for 4 inch wafer
Oxidation/Annealing furnace for 4 inch wafer Annealing furnace for 2 inch wafer

Venture Business Laboratory

PAGETOP
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