{"id":1560,"date":"2020-07-07T16:03:14","date_gmt":"2020-07-07T07:03:14","guid":{"rendered":"http:\/\/int.ee.tut.ac.jp\/pim\/?page_id=1560"},"modified":"2022-04-04T15:52:43","modified_gmt":"2022-04-04T06:52:43","slug":"equipments","status":"publish","type":"page","link":"https:\/\/int.ee.tut.ac.jp\/pim\/equipments\/","title":{"rendered":"Equipments"},"content":{"rendered":"\n

Japanese<\/a><\/p>\n\n\n\n

Semiconductor Manufacturing Equipment (including shared equipment)<\/h4>\n\n\n\n
  • \"\"
    EB evaporator<\/figcaption><\/figure><\/li>
  • \"\"
    EB lithography<\/figcaption><\/figure><\/li>
  • \"\"
    ICP-RIE for GaN<\/figcaption><\/figure><\/li>
  • \"\"
    LED transfer tool<\/figcaption><\/figure><\/li>
  • \"\"
    LP-CVD (poly-Si, SiN,SiO2<\/sub>)<\/figcaption><\/figure><\/li>
  • \"\"
    Deep-RIE<\/figcaption><\/figure><\/li>
  • \"\"
    XeF2<\/sub> Dry Etching Equipment<\/figcaption><\/figure><\/li>
  • \"\"
    Asher apparatus<\/figcaption><\/figure><\/li>
  • \"\"
    Sintering Furnace<\/figcaption><\/figure><\/li>
  • \"\"
    Blade Dicing equipment<\/figcaption><\/figure><\/li>
  • \"\"
    Palylene Coater<\/figcaption><\/figure><\/li>
  • \"\"
    Plasma-enhaced CVD<\/figcaption><\/figure><\/li>
  • \"\"
    Resist Spray Coater<\/figcaption><\/figure><\/li>
  • \"\"
    Reactive Ion Etching using F-based gas<\/figcaption><\/figure><\/li>
  • \"\"
    Wire Bonding equipment<\/figcaption><\/figure><\/li>
  • \"\"
    Mask Aligner<\/figcaption><\/figure><\/li><\/ul><\/figure>\n\n\n\n

    Evaluation Tools<\/h4>\n\n\n\n
    • \"\"
      Probe Station<\/figcaption><\/figure><\/li>
    • \"\"
      Angle resolved PL or EL Evaluation System<\/figcaption><\/figure><\/li>
    • \"\"
      MicroPL System<\/figcaption><\/figure><\/li>
    • \"\"
      FE-SEM<\/figcaption><\/figure><\/li>
    • \"\"
      Stylus-type Step Profiler<\/figcaption><\/figure><\/li>
    • \"\"
      Electric Measuring Instrument<\/figcaption><\/figure><\/li><\/ul><\/figure>\n","protected":false},"excerpt":{"rendered":"

      Japanese Semiconductor Manufacturing Equipment (including shared equipment) Evaluation Tools<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":13,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_lmt_disableupdate":"no","_lmt_disable":"","_background_id":0,"_xo_background":[],"footnotes":""},"_links":{"self":[{"href":"https:\/\/int.ee.tut.ac.jp\/pim\/wp-json\/wp\/v2\/pages\/1560"}],"collection":[{"href":"https:\/\/int.ee.tut.ac.jp\/pim\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/int.ee.tut.ac.jp\/pim\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/int.ee.tut.ac.jp\/pim\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/int.ee.tut.ac.jp\/pim\/wp-json\/wp\/v2\/comments?post=1560"}],"version-history":[{"count":19,"href":"https:\/\/int.ee.tut.ac.jp\/pim\/wp-json\/wp\/v2\/pages\/1560\/revisions"}],"predecessor-version":[{"id":2342,"href":"https:\/\/int.ee.tut.ac.jp\/pim\/wp-json\/wp\/v2\/pages\/1560\/revisions\/2342"}],"wp:attachment":[{"href":"https:\/\/int.ee.tut.ac.jp\/pim\/wp-json\/wp\/v2\/media?parent=1560"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}